1W High Power Red Color LED
LED High Power LED Chip 1W, Green, DC2.55V input, 350mA output,
Energy Saving Lamp, Star, Component Chip
Precautions for Use:
Customer must not use the device in reverse and should apply
resistors for extra protection. Otherwise slight voltage shift may
cause abnormal current change and burn out failure would happen.
①Do not open moisture proof bag before the products are ready to be
②Before opening the package, the LEDs should be kept at 30℃ or less
and 90%RH or less.
③The LEDs should be used within a year.
④After opening the package, the LEDs should be kept at 30℃ or less
and 70%RH or less.
⑤The LEDs should be used within 168 hours (7 days) after opening
⑥If the moisture absorbent material (silicone gel) has faded away
or the LEDs have exceeded the storage time, baking treatment should
be performed using the following conditions:
Pre-curing treatment: 60±5℃ for 24 hours.
3. Thermal Management
①Because HP60M LED is a high power dissipation device, special and
sufficient consideration in thermal management design must be made
to optimize the thermal performance.
②Heat sink design is implemented in the device for an additional
thermal connection. Since the device is capable of SMT process, tin
must be spread both heat sink and solder pads areas to dissipate
③A high thermal conductivity substrate, such as Aluminum or Copper
plate etc, must be applied for external thermal management. It is
strongly recommended that the outer heat sink or PCB dimension per
LED can not be less than 25 x 25 x 1 (L x W x H) mm. The materials
for outer heat sink can be FR4 on Aluminum, MCPCB, or FPC on
④Special thermal designs are also recommended to take in outer heat
sink design, such as FR4 PCB on Aluminum with thermal vias or FPC
on Aluminum with thermal conductive adhesive, etc.
⑤Sufficient thermal management must be conducted, or the die
junction temperature will be over the limit under large electronic
driving and LED lifetime will decrease critically.
4. Soldering Condition
①Soldering should not be done more than two times.
②While soldering, do not put stress on the LEDs during heating.
③After soldering, do not warp the circuit board.
5. Soldering Iron
①For prototype builds or small series production runs it is
possible to place and solder the LED by hand.
②Dispensing thermal conductive glue or grease on the substrates and
follow its curing spec. Press LED housing to closely connect LED
③It is recommended to hand solder the leads with a solder tip
temperature of 280°C for less than 3 seconds within once in less
than the soldering iron capacity 25W. Leave two seconds and more
intervals, and do soldering of each terminal.
④Be careful because the damage of the product is often started at
the time of the hand solder.
6. Handling Indications
During processing, mechanical stress on the surface should be
minimized as much as possible. Sharp objects of all types should
not be used to pierce the sealing compound.
Absolute Maximum Ratings at Ta=25℃
|PeakPulseCurrent (tp≤100μs, Duty cycle=0.25)||I pulse||500||mA|
|LED Junction Temperature||Tj||125||℃|
|Operating Temperature Range||Topr||-40 to +80||℃|
|Storage Temperature Range||Tstg||-40 to +100||℃|
|Soldering Time at 260 ℃ (Max.)||Tsol||5||Seconds|
1. Proper current derating must be observed to maintain junction
temperature below the maximum.
2. LEDs are not designed to be driven in reserve bias.
Electrical Optical Characteristics at Ta=25℃
|Viewing Angle ||2θ1/2||---||140||--||Deg||IF=350mA|
|Forward Voltage ||VF||2.0||2.20||3.00||V||IF=350mA|
|Peak Emission Wavelength||λp||---||632||---||nm||IF=350mA|
|Dominant Wavelength||λd||---||624||---||nm||IF =350mA|
|Spectrum Radiation Bandwidth||Δλ||---||18||---||nm||IF=350mA|
1. 2θ1/2 is the off axis angle from lamp centerline where the luminous
intensity is 1/2 of the peak value. 2. Forward Voltage measurement
High Power LED Package Dimension: